| (Specifications) | ||
| Model No. | DS-250B | DS-300B |
| Control Method | Switching Control | |
| PCB Size(mm) | Max.250mm Max.300mm | |
| Conveyor Speed | 100~2400mm/min. | |
| Pre-heating Zone | Length:1050mm×1 Room Temperature-200℃ | |
| Solder Pot Temperature | Room Temperature~300℃ | |
| PCB Conveyor Direction | L R/L R | |
| PCB Conveyor Height | 750±20mm | |
| PCB Soldering Angle | 4~6° | |
| Flux Spraying Pressure/Flow Rate | 3-4kgf/cm2 10~100ml/min. | |
| Flux Capacity | Approx.4Liters | |
| Spraying Nozzle Move | Stepper Motor | |
| Solder Pot Capacity | Approx.220kg Approx.265kg | |
| Solder Type | Normal Solder | |
| Normal Power/Start up Power | Approx.2.5kw/11.5kw Approx.3kw/13.5kw | |
| Power Supply | 3 phase 5 wires 380V 50/60Hz | |
| Outside Dimension | L3150×W900×H1500mm | |
| Weight | 500kg | 550kg |
| 技术参数 | ||
| 型号 | DS-250B | DS-300B |
| 控制方式 | 按键式控制系统 | |
| PCB板尺寸 | Max.250mm Max.300mm | |
| 传输速度 | 100~2400mm/min. | |
| 预加热区 | 长度:1000mm×1 温度:室温-200℃ | |
| 锡炉温度 | 室温~300℃ | |
| PCB板传送方向 | L R/L R | |
| PCB板传送高度 | 750±20mm | |
| PCB板过锡角度 | 4~6° | |
| 松香喷雾气压/流量 | 3-4kgf/cm2 10~100ml/min. | |
| 松香容量 | Approx.4Liters | |
| 喷头移动方式 | 步进电机 | |
| 锡炉容量 | Approx.220kg | Approx.265kg |
| 适用焊料类型 | 普通焊料 | |
| 正常/启动功率 | Approx.3.5kw/12.5kw Approx.4kw/13.5kw | |
| 电源 | 三相五线制 | |
| 设备外形尺寸 | L3150×W900×H1500mm | |
| 重量 | 500kg | 550kg |
DS-250B.DS-300B经济型双波峰焊锡机
产品特点
★ 炉胆采用分体型设计，小容量、小功率，单独温度控制，经济实用，省电40％。
★特别加长预热区，预热曲线平稳，保证PCB板焊接效果。
★采用速度自行跟踪喷雾系统（三菱PLC控制），使喷雾面积随PCB宽度自动调节。
★ 内置助焊剂喷头自动清洗系统，长期使用亦无需清洗。
★具有经济运行功能，锡波随PCB自动起降，降低氧化量。
★锡渣正常工作氧化量＜1.5公斤/8小时。
DS-250B .DS-300B Direct Dual-wave Soldering machine
Features
Solder pot adopts separate type design,small capacity,low power,independent temperature control,economical and practical, saving electricity by 40%.
Specially extended preheating area, where the preheating profile is stable and can ensure the soldering effect of PCB boards.
Adopting speed auto-track spraying system(Mitsubishi PLC control),making the spraying area automatically adjusted with the width of PCB.
Embeded cleaning system for flux nozzle head, no cleaning is requried even after used for a long time.
With economical operation function, the wave rises and falls with PCB and the quantity of oxidation is reduced.
Normal oxidation quantity of the lead-free soldering is＜1.5kg/8h.
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