PCB Size(mm) | Max.250mm Max.300mm | ||
Conveyor Speed | 100~2400mm/min. | ||
Pre-heating Zone | Length:900mm×1 Room Temperature-200℃ | ||
Solder Pot Temperature | Room Temperature~300℃ | ||
PCB Conveyor Direction | L R/L R | ||
PCB Conveyor Height | 750±20mm | ||
PCB Soldering Angle | 4~6° | ||
Flux Spraying Pressure/Flow Rate | 3-4kgf/cm2 10~100ml/min. | ||
Flux Capacity | Approx.4Liters | ||
Spraying Nozzle Move | Stepper Motor | ||
Solder Pot Capacity | Approx.130kg Approx. 150kg | ||
Solder Type | Normal Solder | ||
Normal Power/Start up Power | Approx.2kw/7.5kw Approx.2.5kw/9kw | ||
Power Supply | 3 phase 5 wires 380V 50/60Hz | ||
Outside Dimension | L2800×W850×H1500mm | ||
Weight | 450kg | 500kg |
型号 | DS-250C | DS-300C | ||
控制方式 | 按键式控制系统 | |||
PCB板尺寸 | Max.250mm Max.300mm | |||
传输速度 | 100~2400mm/min. | |||
预加热区 | 长度:900mm×1 温度:室温-200℃ | |||
锡炉温度 | 室温~300℃ | |||
PCB板传送方向 | L R/L R | |||
PCB板传送高度 | 750±20mm | |||
PCB板过锡角度 | 4~6° | |||
松香喷雾气压/流量 | 3-4kgf/cm2 10~100ml/min. | |||
松香容量 | Approx.4Liters | |||
喷头移动方式 | 步进电机 | |||
锡炉容量 | Approx.130kg Approx. 150kg | |||
适用焊料类型 | 普通焊料 | |||
正常/启动功率 | Approx.2kw/7.5kw Approx.2.5kw/9kw | |||
电源 | 三相五线制 | |||
设备外形尺寸 | L2800×W850×H1500mm | |||
重量 | 450kg | 500kg |
DS-250C.DS-300C经济型单波峰焊锡机
产品特点:
★ 炉胆采用小容量、小功率设计,经济实用,省电40%。
★ 特别加长预热区,预热曲线平稳,保证PCB板焊接效果。
★ 采用速度自行跟踪喷雾系统(三菱PLC控制),使喷雾面积随PCB宽度自动调节。
★ 内置助焊剂喷头自动清洗系统,长期使用亦无需清洗。
★具有经济运行功能,锡波随PCB自动起降,降低氧化量。
★锡渣正常工作氧化量<1.0公斤/8小时。
DS--250C .300C Direct Single-Wave Crest Soldering machine
Features:
Solder pot adopts small capacity, low power design, economical and practical, saving electricity by 40%.
Specially extended preheating area, where the preheating profile is stable and can ensure the soldering effect of PCB boards.
Adopting speed auto-track spraying system(Mitsubishi PLC control),making the spraying area automatically adjusted with the width of PCB.
Embeded cleaning system for flux nozzle head, no is requried even after used for a long time.
With economical operation function, the wave rises and falls with PCB and the quantity of oxidation is reduced.
Normal oxidation quantity of the lead-free soldering is<1.0kg/8h.